The MAX152 high-speed, microprocessor (µP)-compatible, 8-bit analog-to-digital converter (ADC) uses a half-flash technique to achieve a 1.8µs conversion time, and digitizes at a rate of 400k samples per second (ksps). It operates with single +3V or dual ±3V supplies and accepts either unipolar or bipolar inputs.A POWERDOWN pin reduces current consumption to a typical value of 1µA. The part returns from powerdown and acquires an input signal in less than 900ns, providing large reductions in supply current in applications with burst-mode input signals. The MAX152 is DC and dynamically tested. Its µP interface appears as a memory location or input/output port that requires no external interface logic. The data outputs use latched, three-state buffered circuitry for direct connection to a µP data bus or system input port. The ADC's input/reference arrangement enables ratiometric operation. A fullyassembled evaluation kit provides a proven PC board layout to speed prototyping and design.
The MAX152 is DC and dynamically tested. Its µP interface appears as a memory location or input/output port that requires no external interface logic. The data outputs use latched, three-state buffered circuitry for direct connection to a µP data bus or system input port. The ADC's input/reference arrangement enables ratiometric operation. A fullyassembled evaluation kit provides a proven PC board layout to speed prototyping and design.
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Cellular TelephonesPortable RadiosBattery-Powered SystemsBurst-Mode Data AcquisitionDigital Signal ProcessingTelecommunicationsHigh-Speed Servo Loops
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Single +3.0V to +3.6V Supply1.8µs Conversion TimePower-Up in 900nsInternal Track/Hold400ksps ThroughputLow Power: 1.5mA (Operating Mode) 1µA (Power-Down Mode)300kHz Full-Power Bandwidth20-Pin DIP, SO and SSOP PackagesNo External Clock RequiredUnipolar/Bipolar InputsRatiometric Reference Inputs2.7V Version Available Contact Factory
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VDD to GND ...........................................................-0.3V to +7V
VSS to GND............................................................+0.3V to -7V
Digital Input Voltage to GND .......................-0.3V, (VDD + 0.3V)
Digital Output Voltage to GND ....................-0.3V, (VDD + 0.3V)
VREF+ to GND................................(VSS - 0.3V) to (VDD + 0.3V)
VREF- to GND.................................(VSS - 0.3V) to (VDD + 0.3V)
VIN to GND.....................................(VSS - 0.3V) to (VDD + 0.3V)
Continuous Power Dissipation (TA = +70°C)
Plastic DIP (derate 11.11mW/°C above +70°C) ..........889mW
Wide SO (derate 10.00mW/°C above +70°C)..............800mW
SSOP (derate 8.00mW/°C above +70°C) ....................640mW
CERDIP (derate 11.11mW/°C above +70°C) ...............889mW
Operating Temperature Ranges:
MAX152C__ ........................................................0°C to +70°C
MAX152E__ .....................................................-40°C to +85°C
MAX152MJP ...................................................-55°C to +125°C
Storage Temperature Range ...........................-65°C to +150°C
Lead Temperature (soldering, 10sec) ............................+300°C
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